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Radar · South Korea | Sens.ai

Radar · Entity

South Korea

Everything the desk has tracked for this country.

CountryKR

Model releases

No tracked model releases for this entity yet.

Research papers

LLM agentsAI safety and assurancepublished Jul 10, 2026 · arXiv:2607.08028

From Prompts to Contracts: Harness Engineering for Auditable Enterprise LLM Agents

Recent source items

most recently published, newest first

SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chipAug 25, 2026
Samsung Display resumes A7 construction as foldable demand reboundsAug 25, 2026
Nvidia’s Inference Pivot Reaches Rebellions in KoreaAug 24, 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands fasterAug 24, 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPOAug 24, 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26Aug 23, 2026
AI memory windfall: Samsung to hand back up to US$79 billion in 2026Aug 22, 2026
Nvidia and South Korean chip startup Rebellions discussing potential collaboration – reportAug 21, 2026
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focusAug 21, 2026
HP Korea localizes AI strategy with Upstage in healthcare, financeAug 21, 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan'sAug 21, 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan'sAug 21, 2026
Elice to build South Korea's first warm-water-cooled AI data center, unveils coding agentAug 20, 2026
Korean display makers step up OLED patent push as China narrows technology gapAug 20, 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South KoreaAug 20, 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027Aug 20, 2026
Nvidia physical AI executive Madison Huang appears at Beijing WRC after LG Seoul visitAug 20, 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in SeptemberAug 20, 2026
CXMT planned to use Samsung process data to develop DRAM, ex-engineer saysAug 20, 2026
Intel Malaysia packaging expansion draws HBM flows from TaiwanAug 20, 2026